21st Century ManufacturingPrentice Hall, 2001 - 460 من الصفحات Written in a conversational style, this book explores today's technologies and the future of manufacturing -- through details of the product design process, rapid prototyping, a survey of manufacturing techniques relevant to today's production of consumer electronics or electromechanical devices, and the field of Biotechnology. It gives readers a broader appreciation of the impact of manufacturing process and not just manufacturing per se. A overview of the broader issues includes: the time to market, development of a new product, launching products into the marketplace, quality control, and the impact of technology on the next generation of products. Chapter topics cover manufacturing analysis; product design, computer aided design, and solid modeling; solid freeform fabrication and rapid prototyping; semiconductor manufacturing; computer manufacturing; metal-products manufacturing; plastics-products manufacturing and system assembly; and biotechnology. For executive education courses, appealing to both engineering and business professionals. |
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... package types , the dual - in - line package . The single IC is shown on the front right side . It is set onto the base with epoxy or a metal alloy . The wire bonds ( shown darker ) run from bonding pads on the IC to the lead frame of ...
... package . The bottom of the die is secured with a metal - filled epoxy , or with a 96 % gold - 4 % silicon eutectic ... package . Figure 5.31 shows the delicate wires running from the bonding pads ( typically 100 to 125 microns in ...
Paul Kenneth Wright. Table 5.5 includes examples : TABLE 5.5 Package and Test Costs ( Courtesy of MIPS Technologies ) Package type Pin count Package cost ( $ ) Test time ( sec ) Test cost per hour ( $ ) PQFP < 220 12 10 300 PQFP < 300 20 ...
المحتوى
ART TECHNOLOGY SCIENCE | 1 |
PLASTICPRODUCTS MANUFACTURING AND FINAL | 8 |
SOME BASIC QUESTIONS | 21 |
حقوق النشر | |
13 من الأقسام الأخرى غير ظاهرة