...of the existing material on the surface of the wafer. The process may be repeated as many as twenty times during the manufacture of a semiconductor device,...to the previous layer (Watts and Einspruch, 1987). Figure 8.2 is a very simplified representation of this complex process. A photolithographic aligner...

...used as the basis for further processing (Figure 9.3). This process may be repeated as many as twenty times during the manufacture of a semiconductor device,...precisely with respect to the previous layer (Watts & Einspruch, 1987). Photolithographic aligners are used to position the mask accurately with respect...